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JCID Non removal FPC Flex Repair iPhone Face ID Without Soldering BGA Soldering Station iClean E08 B Specification: iClean E08 B Specification: Huawei BAH2 L09 32GB [Huawei Bach 2] For iPhone X 17 Pro MAX Face ID repair JCID 17 series Face ID repair expansion board needs to be used on the jcid 13 16 series dot matrix activation read write board
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JCID Non-removal FPC Flex Repair iPhone Face ID Without Soldering BGA Soldering Station iClean E08-B Specification:

Item no : 55194930610
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US$ 22.99
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Min. order: 1piece

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